Electronics Hardware Packaging Engineer

Job Overview

Komatsu is an indispensable partner to the construction, mining, forestry, forklift, and industrial machinery markets, maximizing value for customers through innovative solutions. With a diverse line of products supported by our advanced IoT technologies, regional distribution channels, and a global service network, we tap into the power of data and technology to enhance safety and productivity while optimizing performance. Komatsu supports a myriad of markets, including housing, infrastructure, water, pipeline, minerals, automobile, aerospace, electronics and medical, through its many brands and subsidiaries, including TimberPro, Joy, P&H, Montabert, Modular Mining Systems, Hensley Industries, NTC, and Gigaphoton.

Key Job Responsibilities

• Create, refine designs for electronic hardware enclosure packaging for devices including sensors, control and automation hardware for use in hazardous underground mining environment
• Responsible for choosing appropriate materials for packaging based on electrical, thermal, and mechanical properties as well as cost-effectiveness and manufacturability
• Engage with an experienced cross-disciplinary team to formulate and design innovative products
• Support design reviews with internal teams and suppliers
• Conduct tests to evaluate performance of electronic enclosure packaging designs, including and validation of hardware prior to their release
• Work with design team to specify mounting strategies, mechanical keep outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces to the PCB assembly
• Perform thermal analysis of electronics and design enclosures with proper thermal management to ensure electronic components operate within safe temperature ranges
• Perform modal and vibration analyses of electronic assemblies with mechanical/structural components
• Ensure enclosures comply with industry standards and regulations such as IP ratings for ingress protection, and regulatory requirements
• In addition to electronics packaging, candidate will be responsible for design of test fixtures
• Support vibration, shock, and thermal tests of products designed
• Responsible for development of CAD designs, part drawings and assembly drawings
• Up to 5% of travel is possible

Qualifications/Requirements

• BS in Mechanical or related degree with 10 years industry experience in designing ruggedized electronics enclosure packaging
• Design electro-mechanical assemblies that comply with requirements for thermal , EMI/EMC, shock and vibration specifications
• Experience with modeling PCBA with enclosures
• Experience with 3D CAD tools such as Autodesk Inventor
• Experience in building prototype enclosures, configuring, maintaining 3D printers
• Experience designing for CNC machining and sheet metal production, as well as selecting appropriate materials and finishing processes

Additional Information